ltd595/62-xx-pf triple digit led display (0.56 inch) ltd595/62-xx-pf 22 - feb. data sheet doc. no : qw0905- rev. : a date : - 2007 ligitek electronics co.,ltd. property of ligitek only lead-free parts pb
a e f dp d c g b ligitek electronics co.,ltd. property of ligitek only page1/8 package dimensions part no.ltd595/62-xx-pf note : 1.all dimension are in millimeters and (lnch) tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. ltd595/62-xx-pf ligitek pin no.1 4.5 0.5 ? 0.51 typ 2.54x5=12.7 (0.5 ? ) 15.24 (0.6 ? ) 19.0 (0.75 ? ) 14.2 (0.56 ? 37.6(1.48 ? ) 1.6 8.0 (0.315 ? )
2/8 page internal circuit diagram ligitek electronics co.,ltd. property of ligitek only ltd5962-xx-pf ltd5952-xx-pf nc: 6pin part no.ltd595/62-xx-pf
3/8 page 1 pin no.1 3 4 5 6 cathode dp cathode c nc 2 cathode d ltd5952-xx-pf anode dp anode c nc anode d ltd5962-xx-pf ligitek electronics co.,ltd. property of ligitek only 8 9 10 11 cathode a 12 anode a 7 1 3 4 5 6 2 8 9 10 11 12 7 pin no.1 electrical connection part no. ltd595/62-xx-pf anode e cathode e common cathode dig.3 common anode dig.3 common cathode dig2 common anode dig.2 common cathode dig.1 common anode dig.1 anode g cathode g anode b cathode b anode f cathode f
4/8 page unit ma ma a iv-m iv(mcd) mw 2:1 min. 4.0 typ. 7.2 7.2 4.02:1 30 g 120 ratings i f parameter symbol i fp 10 -25 ~ +85 -25 ~ +85 vf(v) ir chip t opr tstg 100 pd forward current per chip operating temperature power dissipation per chip reverse current per any chip peak forward current per chip (duty 1/10,0.1ms pulse width) absolute maximum ratings at ta=25 storage temperature part no max. 2.6 min. 1.7 typ. 2.1 2.6 2.1 1.7 30 565 30 565 emitted green green gap gap material common cathode common anode note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. ltd5962-xx-pf ltd5952-xx-pf (nm) p ( nm) common cathode or anode ligitek electronics co.,ltd. property of ligitek only electrical solder temperature 1/16 inch below seating plane for 3 seconds at 260 part selection and application information(ratings at 25) part no. ltd595/62-xx-pf
page5/8 if=20ma if=20ma if=20ma if=10ma unit volt mcd nm nm vf symbol p iv ligitek electronics co.,ltd. property of ligitek only test condition vr=5v a ir iv-m parameter luminous intensity per chip peak wavelength forward voltage per chip spectral line half-width reverse current any chip luminous intensity matching ratio test condition for each parameter part no. ltd595/62-xx-pf
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) page forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 g chip fig.6 directive radiation 6/8 part no. ltd595/62-xx-pf
page 7/8 ligitek electronics co.,ltd. property of ligitek only soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:solder temperature 1/16 inch below seating plane for 3 seconds at 260 c 2.wave soldering profile dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:solder temperature 1/16 inch below seating plane for 3 seconds at 260 c time(sec) 150 260 c3sec max 5 /sec max 100 2 /sec max preheat 50 260 temp( c) 120 0 25 0 60 seconds max note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. part no. ltd595/62-xx-pf
1.t.sol=260 5 2.dwell time= 10 1sec. solder resistance test this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 solderability test 1.t.sol=230 5 2.dwell time=5 1sec mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 this test intended to see soldering well performed or not. 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.under room temperature 2.if=10ma 3.t=1000 hrs (-24hrs, +72hrs) operating life test thermal shock test high temperature high humidity test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs low temperature storage test high temperature storage test reliability test: test itemtest condition this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. page ligitek electronics co.,ltd. property of ligitek only reference standard description 8/8 part no. ltd595/62-xx-pf
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